JPH0642347Y2 - リードフレーム - Google Patents

リードフレーム

Info

Publication number
JPH0642347Y2
JPH0642347Y2 JP5979788U JP5979788U JPH0642347Y2 JP H0642347 Y2 JPH0642347 Y2 JP H0642347Y2 JP 5979788 U JP5979788 U JP 5979788U JP 5979788 U JP5979788 U JP 5979788U JP H0642347 Y2 JPH0642347 Y2 JP H0642347Y2
Authority
JP
Japan
Prior art keywords
lead frame
connecting strip
support plate
external leads
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5979788U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01163342U (en]
Inventor
重寿 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP5979788U priority Critical patent/JPH0642347Y2/ja
Publication of JPH01163342U publication Critical patent/JPH01163342U/ja
Application granted granted Critical
Publication of JPH0642347Y2 publication Critical patent/JPH0642347Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP5979788U 1988-05-07 1988-05-07 リードフレーム Expired - Lifetime JPH0642347Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5979788U JPH0642347Y2 (ja) 1988-05-07 1988-05-07 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5979788U JPH0642347Y2 (ja) 1988-05-07 1988-05-07 リードフレーム

Publications (2)

Publication Number Publication Date
JPH01163342U JPH01163342U (en]) 1989-11-14
JPH0642347Y2 true JPH0642347Y2 (ja) 1994-11-02

Family

ID=31285537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5979788U Expired - Lifetime JPH0642347Y2 (ja) 1988-05-07 1988-05-07 リードフレーム

Country Status (1)

Country Link
JP (1) JPH0642347Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5884506B2 (ja) * 2012-01-23 2016-03-15 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPH01163342U (en]) 1989-11-14

Similar Documents

Publication Publication Date Title
EP0767494B1 (en) Method of fabricating power semiconductor device and lead frame
JP2602076B2 (ja) 半導体装置用リードフレーム
US20120007224A1 (en) Semiconductor device
US5708294A (en) Lead frame having oblique slits on a die pad
JP3866127B2 (ja) 半導体装置
JP2005142554A (ja) リードフレーム及びこれを適用した半導体パッケージの製造方法
KR100721279B1 (ko) 반도체 칩 조립체의 형성 방법과 기판 상의 회로로부터반도체 칩으로 와이어 본드부를 형성하는 장치
JPH0642347Y2 (ja) リードフレーム
US20020056894A1 (en) Leadframe having slots in a die pad
US6828659B2 (en) Semiconductor device having a die pad supported by a die pad supporter
JP2517691B2 (ja) 半導体装置及びその製造方法
JP3290869B2 (ja) 半導体装置
JP3144383B2 (ja) 半導体装置
JPH0642346Y2 (ja) リードフレーム
JPH10270623A (ja) ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
JP3768762B2 (ja) 樹脂パッケージ型半導体装置
JP2679848B2 (ja) 半導体装置
JP3578236B2 (ja) チップ型半導体装置の製造方法
JP3034517B1 (ja) 半導体装置およびその製造方法
JP3667315B2 (ja) 放熱板付きリードフレームの製造方法
JP3813680B2 (ja) 半導体装置の製造方法
JP2503646B2 (ja) リ―ドフレ―ムおよび半導体集積回路装置
JPH09191072A (ja) リードフレーム
EP1302983A1 (en) Leadframe having slots in a die pad
JPH0236557A (ja) リードフレームおよびそれを用いた半導体装置